In Stock:
212
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 2297.49 | |
| 10 | 2251.5402 | |
| 100 | 2182.6155 | |
| 1000 | 2113.6908 | |
| 10000 | 2021.7912 |
Specification
Speed533MHz, 1.3GHz
SeriesZynq® UltraScale+™ MPSoC CG
HTS Code8542.31.00.01
RAM Size256KB
PackagingTray
Published2016
TechnologyCMOS
Part StatusActive
PeripheralsDMA, WDT
RoHS StatusROHS3 Compliant
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-30 CodeR-PBGA-B900
Number of I/O204
Surface MountYES
Terminal FormBALL
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case900-BBGA, FCBGA
Supply Voltage0.85V
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Primary AttributesZynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature-40°C~100°C TJ
Number of Terminations900
Supply Voltage-Max (Vsup)0.876V
Supply Voltage-Min (Vsup)0.825V
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)NOT SPECIFIED
Moisture Sensitivity Level (MSL)4 (72 Hours)
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
